JPH0144012B2 - - Google Patents

Info

Publication number
JPH0144012B2
JPH0144012B2 JP59199460A JP19946084A JPH0144012B2 JP H0144012 B2 JPH0144012 B2 JP H0144012B2 JP 59199460 A JP59199460 A JP 59199460A JP 19946084 A JP19946084 A JP 19946084A JP H0144012 B2 JPH0144012 B2 JP H0144012B2
Authority
JP
Japan
Prior art keywords
wafer
temperature
surface treatment
liquid
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59199460A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6178123A (ja
Inventor
Kazuo Nishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP19946084A priority Critical patent/JPS6178123A/ja
Publication of JPS6178123A publication Critical patent/JPS6178123A/ja
Publication of JPH0144012B2 publication Critical patent/JPH0144012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP19946084A 1984-09-26 1984-09-26 基板の表面処理装置 Granted JPS6178123A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19946084A JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19946084A JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Publications (2)

Publication Number Publication Date
JPS6178123A JPS6178123A (ja) 1986-04-21
JPH0144012B2 true JPH0144012B2 (en]) 1989-09-25

Family

ID=16408168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19946084A Granted JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Country Status (1)

Country Link
JP (1) JPS6178123A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086486A (ja) * 2001-09-11 2003-03-20 Canon Inc 露光装置
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
CN102896104B (zh) * 2012-10-15 2014-12-10 京东方科技集团股份有限公司 一种基板清洗设备及基板清洗系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511311A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Method of photoresist developing
JPS57166032A (en) * 1981-04-03 1982-10-13 Toshiba Corp Spray type developing device for positive resist
JPS5868749A (ja) * 1981-10-21 1983-04-23 Toshiba Corp レジスト現像装置
JPS58128441U (ja) * 1982-02-24 1983-08-31 富士通株式会社 現像装置
JPS6083240U (ja) * 1983-11-15 1985-06-08 富士通株式会社 スピン現像機

Also Published As

Publication number Publication date
JPS6178123A (ja) 1986-04-21

Similar Documents

Publication Publication Date Title
US5942035A (en) Solvent and resist spin coating apparatus
US6398879B1 (en) Method and apparatus for cleaning treatment
JP3587723B2 (ja) 基板処理装置および基板処理方法
US5580607A (en) Coating apparatus and method
US5376176A (en) Silicon oxide film growing apparatus
KR100706666B1 (ko) 기판을 처리하는 장치 및 방법, 그리고 이에 사용되는분사헤드
US8286580B2 (en) Apparatus and method for treating substrate
KR19990013572A (ko) 처리액공급장치
EP0223237A2 (en) Automatic developing apparatus
US6893172B2 (en) Developing apparatus and developing method
CN100390931C (zh) 基板处理装置、基板处理方法及图案形成方法
KR100611060B1 (ko) 기판 상으로 용액을 공급하기 위한 장치
JPH0144012B2 (en])
JP2903284B2 (ja) 処理装置及び処理方法
JPS6253591B2 (en])
JPS636843A (ja) 基板現像処理方法
JP2003077878A (ja) 液処理方法及び液処理装置
JPS62279632A (ja) 半導体製造装置
US5937878A (en) Apparatus for removing particles from a wafer and for cleaning the wafer
JPH0132360Y2 (en])
JPH0746347Y2 (ja) 薬品処理装置
JP3629232B2 (ja) 回転式薄膜形成装置及び薄膜形成方法
JP2005286231A (ja) 温度調節システム及び温度調節方法
JP2759369B2 (ja) 液処理装置及び液処理方法
KR200182720Y1 (ko) 화학 기계적 연마 시스템의 웨이퍼 캐리어 세정 장치